Trends of Technologies in Build-Up Type Multilayer Boards-Key Technology for High Density Packaging. Build-Up Multilayer Board with Full Additive Technology.

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ژورنال

عنوان ژورنال: The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

سال: 1996

ISSN: 1884-1201,1341-0571

DOI: 10.5104/jiep1995.11.472